The white pad is designed for use with first and second step polishing compounds. Foam structure maintains the compound on the surface of the sponge which provides accurate developing particles and full utilization of the compound. Application: polishing compounds from cutting to polishing type. 

Main product features. Foam: 

● Optimally selected shapes 

● The homogeneous structure of high strength 

● Specially shaped surface 

● proper hardness Mounting: 

● Polyamide velour to ensure strong connection Connection: 

● The adhesive is matched individually to the bonded substrates. 

● Resistance to temperature, aqueous environment and organic solvents The product shows the resistance to prolonged exposure to temperatures up to 110 ° C.