Black pad is designed to work with last step compounds. The structure of the foam quickly gives off heat. Application: Anti-Hologram paste and mechanical applying of polishes. 

Main product features. Foam: 

● Optimally selected shapes 

● The homogeneous structure of high strength 

● Specially shaped surface ● proper hardness Mounting: 

● Polyamide velour to ensure strong connection Connection: 

● The adhesive is matched individually to the bonded substrates. 

● Resistance to temperature, aqueous environment and organic solvents The product shows the resistance to prolonged exposure to temperatures up to 110 ° C.