Red pad is designed to work with the second step polishing compounds. Foam structure maintains the paste on the surface of the pad which provides accurate developing particles and full utilization of the paste. Application: second step polishing compounds and One Step compounds.

Main product features. Foam: 

● Optimally selected shapes 

● The homogeneous structure of high strength 

● Specially shaped surface 

● proper hardness Mounting: 

● Polyamide velour to ensure strong connection Connection: 

● The adhesive is matched individually to the bonded substrates. 

● Resistance to temperature, aqueous environment and organic solvents The product shows the resistance to prolonged exposure to temperatures up to 110 ° C.