Polishing Pad Waffle 83X25mm

 Black pad is designed for use with first step polishing compounds and compounds formatting. Foam structure is characterized by high aggressiveness which helps to permanently remove deep scratches while preparing surfaces for subsequent stages of paint correction. Usage: to enhance the effect of cutting for the polishing compounds. Specific shape minimizes signs of spin/holograms. For using the features of this product effectively we recommend working with less downforce for preventing flattening of the work surface.